COURT OF APPEAL (CIVIL DIVISION)
ON APPEAL FROM THE HIGH COURT OF JUSTICE
(CHANCERY DIVISION)
MR JUSTICE MANN
HC 04 CO 2060
Strand, London, WC2A 2LL |
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B e f o r e :
LADY JUSTICE ARDEN
and
MR JUSTICE LEWISON
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THORN SECURITY LIMITED |
Appellant |
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- and - |
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SIEMENS SCHWEIZ AG |
Respondent |
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MR RICHARD MILLER QC and MS HEATHER LAWRENCE (instructed by Pinsent Masons) for the Respondent
Hearing dates : 15-17 July 2008
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Crown Copyright ©
LORD JUSTICE MUMMERY:
This is the judgment of the court to which all of its members have contributed.
Introduction
The patent in suit
"The invention concerns a printed circuit board, having a protective coating made from an electrically insulating, thermoplastic material, and a process for manufacturing such a printed circuit board with protective coating."
"Based on this prior art, the object of the invention is to create a printed circuit board with a protective coating of the type referred to above, in which the protective coating does not have the disadvantages of the prior art. In particular, the protective coating can be applied to all parts of the printed circuit board in the shortest time by means of a simple process with low maintenance devices, with uniform layer thickness and virtually complete imperviousness to air and fluids, and allows a specific component to be left free-standing with precision. A further object of the invention is to form the protective coating in such a way that during the entire life of the printed circuit boards, the individual circuit elements can be measured through the protective coating and individual components can be replaced, even after the protective coating has been completed."
"According to a particularly preferred process, the plastic film is formed from [a] strip by water-jet cutting, is brought to a plastic state by heating after positioning on the printed circuit board and is pressed onto the electronic modules by means of a silicone plug, so as to produce a tightly-fitting topography and to displace existing residual air, and in a final process step the protective coating is fused onto the printed circuit board under the action of further heating"
"The best material proved to be one having a softening point above 100°C or a melting range of 120°C to 170°C, which when solidified on the printed circuit board forms a pore-free coating which is impervious to air and fluids … The film thickness is chosen so that the irregularities on the printed conductor, and especially solder spikes, are reliably coated without tearing the film during fusing. A film thickness of approximately 0.2 to 1.0 mm is usually adequate. Thicker films of several millimetres' thickness can also be used for special applications, for example protecting printed circuit boards which have projecting components or sharp points"
"The film 16 is then heated to a temperature above the softening point in process step D, but without melting it. In process step E the softened film is pressed over the electronic components by means of a soft silicone plug, the film coming into close contact with the components, so that residual air is displaced. In a final process step the protective coating is fused onto the printed circuit board by further heating. This can be achieved advantageously by means of an infrared heater arranged above the film, or by other means, for example with the aid of hot air or a hot inert gas.
The protective coating 16 formed on the printed circuit board 9 covers the modules 13 to be protected, especially irregularities and points on them, with a layer of uniform thickness which is impervious to air and fluids, and reliably protect them against environmental influences. At the same time, partially exposed locations, for example for switches, potentiometers, test points and the like can easily be obtained without additional cost."
"Printed circuit board for electronic modules, having a protective coating made from an electrically insulating, thermoplastic material,
the protective coating consisting of a plastic film made from an electrically insulating, thermoplastic material
to which wax is added to improve its flow properties,
said wax at the same time facilitating through-plating and soldering operations through the protective coating,
and the geometrical shape of the plastic film corresponds to the area of the printed circuit board to be protected,
and the film is fused onto the printed circuit board by the action of heat,
so that it covers the printed circuit board in a virtually air-tight and moisture-proof manner."
Thorn's product
i) Material known as Easybond 90-795C is used. It is purchased as a standard polyolefin polymer which is known to contain 5% wax.ii) It has a softening point defined by the "ring and ball" test as being between 96° and 115° C.
iii) Raw pellets of the material are melted and turned into a strip of film 300 microns thick. These are mounted on a backing.
iv) It is then "kiss-cut" to shape.
v) Having been brought to the PCB manufacturing facility, the shapes are peeled from the backing "and loaded to the PCB, ensuring that the PCB contour matches that of the patch".
vi) The PCB and patch are loaded into the bottom half of a clam-shell press incorporating a silicone moulded pressure pad designed to match the contour of the PCB.
vii) The pressure pad is maintained at a temperature of between 50° and 80°C "to ensure that the polyolefin sealant patch material is at an optimal condition to achieve good adhesion to the printed circuit board and adopt the contour of the various SM [surface mounted] components.."
viii) The shell is clamped shut and vacuum is applied to the closed press to prevent the formation of unwanted air bubbles.
ix) The silicone moulded pad presses the polyolefin sealant patch into intimate contact with the underside [sic] of the PCB so that it adheres to its contour.
x) When the pressure differential drops sufficiently the shell is opened and the now sealed PCB is removed.
xi) A repair process is described. During this process the polyolefin patch is partially removed by melting it down with a hot air gun. It disperses, leaving a hole down to the component(s) solder pads on the PCB. Components can be removed and new components fitted through any remaining thin layer of polyolefin material without the need for totally cleaning the area to be repaired down to the surface of the PCB. Soldering and de-soldering of components uses a soldering iron set at around 380 degrees centigrade.
What the judge decided
Two questions of construction
"an invention for a patent for which an application has been made or for which a patent has been granted shall, unless the context otherwise requires, be taken to be that specified in a claim of the specification of the application or patent, as the case may be, as interpreted by the description and any drawings contained in that specification…"
"One possible explanation is that it does not represent what the patentee really meant to say. But another is that he did mean it, for reasons of his own; such as wanting to avoid arguments with the examiners over enablement or prior art and have his patent granted as soon as possible. This feature of the practical life of a patent agent reduces the scope for a conclusion that the patentee could not have meant what the words appear to be saying."
Appeal on fact
"The need for appellate caution in reversing the judge's evaluation of the facts is based upon much more solid grounds than professional courtesy. It is because specific findings of fact, even by the most meticulous judge, are inherently an incomplete statement of the impression which was made upon him by the primary evidence. His expressed findings are always surrounded by a penumbra of imprecision as to emphasis, relative weight, minor qualification and nuance (as Renan said, la vérité est dans une nuance), of which time and language do not permit exact expression, but which may play an important part in the judge's overall evaluation. It would in my view be wrong to treat Benmax as authorising or requiring an appellate court to undertake a de novo evaluation of the facts in all cases in which no question of the credibility of witnesses is involved. Where the application of a legal standard such as negligence or obviousness involves no question of principle but is simply a matter of degree, an appellate court should be very cautious in differing from the judge's evaluation."
"'[14] The approach of the court to any particular case will depend upon the nature of the issues and the kind of case determined by the judge. This has been recognised recently in, for example, Todd v Adam [2002] 2 All ER (Comm) 97 and REEF Trade Mark v Bessant (t/a REEF) [2003] RPC 101. In some cases the trial judge will have reached conclusions of primary fact based almost entirely upon the view which he formed of the oral evidence of the witnesses. In most cases, however, the position is more complex. In many such cases the judge will have reached his conclusions of primary fact as a result partly of the view he formed of the oral evidence and partly from an analysis of the documents. In other such cases, the judge will have made findings of primary fact based entirely or almost entirely on the documents. Some findings of primary fact will be the result of direct evidence, whereas others will depend upon inference from direct evidence of such facts.
[15] In appeals against conclusions of primary fact the approach of an appellate court will depend upon the weight to be attached to the findings of the judge and that weight will depend upon the extent to which, as the trial judge, the judge has an advantage over the appellate court; the greater that advantage the more reluctant the appellate court should be to interfere. As I see it, that was the approach of the Court of Appeal on a "rehearing" under the RSC and should be its approach on a "review" under the CPR.
[16] Some conclusions of fact are, however, not conclusions of primary fact of the kind to which I have just referred. They involve an assessment of a number of different factors which have to be weighed against each other. This is sometimes called an evaluation of the facts and is often a matter of degree upon which different judges can legitimately differ. Such cases may be closely analogous to the exercise of a discretion and, in my opinion, appellate courts should approach them in a similar way.
[17] In Todd v Adam, where the question was whether a contract of service existed, Mance LJ ([2002] 2 All ER (Comm) 97 at [129]) drew a distinction between challenges to conclusions of primary fact or inferences from those facts and an evaluation of those facts, as follows:
"With regard to an appeal to this court (which would never have involved a complete rehearing in that sense), the language of 'review' may be said to fit most easily into the context of an appeal against the exercise of a discretion, or an appeal where the court of appeal is essentially concerned with the correctness of an exercise of evaluation or judgment—such as a decision by a lower court whether, weighing all relevant factors, a contract of service existed. However, the references in CPR 52.11(3) and (4) to the power of an appellant court to allow an appeal where the decision below was 'wrong' and to 'draw any inference of fact which it considers justified on the evidence' indicate that there are other contexts in which the court of appeal must, as previously, make up its own mind as to the correctness or otherwise of a decision, even on matters of fact, by a lower court. Where the correctness of a finding of primary fact or of inference is in issue, it cannot be a matter of simple discretion how an appellant court approaches the matter. Once the appellant has shown a real prospect (justifying permission to appeal) that a finding or inference is wrong, the role of an appellate court is to determine whether or not this is so, giving full weight of course to the advantages enjoyed by any judge of first instance who has heard oral evidence. In the present case, therefore, I consider that (a) it is for us if necessary to make up our own mind about the correctness or otherwise of any findings of primary fact or inferences from primary fact that the judge made or drew and the claimants challenge, while (b) reminding ourselves that, so far as the appeal raises issues of judgment on unchallenged primary findings and inferences, this court ought not to interfere unless it is satisfied that the judge's conclusion lay outside the bounds within which reasonable disagreement is possible. In relation to (a) we must, as stated, bear in mind the important and well-recognised reluctance of this court to interfere with a trial judge on any finding of primary fact based on the credibility or reliability of oral evidence. In the present case, however, while there was oral evidence, its content was largely uncontentious."
"The judgment of Ward LJ in the Assicurazioni Generali case may be read as advocating a different test, which would equate the approach of an appellate court to findings of fact with its approach to decisions taken in the exercise of a discretion. As Waller LJ correctly pointed out in Manning v Stylianou [2006] EWCA Civ 1655, that is not the correct test, and it is the judgment of Clarke LJ in the paragraphs quoted above from his judgment that gives proper guidance as to the role of the Court of Appeal when faced with appeals on fact."
The judge's general findings
i) Speed of penetration of a soldering iron;ii) The easier flowing away of the coating from the site of the repair; and
iii) The flowing back of the coating once the repair was complete.
"The evidence is in an unsatisfactory state. There is evidence about the general qualities of the Thorn waxed product when compared with the wax-less product, and there is general evidence about the sort of qualities that the two products have in terms of viscosity, wetting ability and so on. However, proof of infringement depends in this case, and in relation to the point currently in issue, on its being established that the Thorn product actually has a certain (facilitating) quality. The only experiment which sought to address that point directly was Experiment 3, and for the reasons given above it did not achieve the result contended for by Siemens. I was not given any explanation as to why experiments going more directly to the effects of penetration, through-plating and soldering were not carried out, or why presumably simple visual observations of the experimented-on board were not carried out. Siemens is therefore thrown back on such conclusions about the Thorn product as can be safely and properly drawn from evidence as to the general nature of the product and as to the views of the experts as to how they would expect it to perform when certain operations were carried out. Since those matters could in my opinion have been more directly addressed by experimentation or observation, and since Siemens has the factual burden of proof on this issue, I approach the exercise with caution so far as Siemens' submissions are concerned."
"Based on all that evidence I make the following findings and determinations on facilitation of through-contacting and soldering through the coating, and bearing in mind my conclusions as to the importance of a beneficial practical effect before anything can be said to have been "facilitated":
(i) There is no direct evidence demonstrating the extent to which Thorn's coating is more easily penetrated by a soldering iron than a wax-less coating would be. By direct evidence I mean evidence of an actual exercise carried out on its coating in an attempt to measure that phenomenon. Experiment 3 did not measure that because there was no comparison with a wax-less coating.
(ii) I accept Mr Godfrey's evidence that in terms of penetrability there is no material practical difference between the waxed product and the wax-less product in relation to a soldering iron at a normal temperature – something over 300°C according to Mr Godfrey.
(iii) However, the nature of the waxed product, when compared with the wax-free product, is such that there are three significant and desirable practical consequences of using the former in the context of carrying out through-plating operations and soldering operations. First, the presence of wax means that melting occurs more easily and therefore charring or similar damage to the film is less likely to arise from heating at the high temperature of a "normal" soldering iron – see Prof Ehrenstein. Second, there would be a noticeable difference if one were using a lower temperature soldering iron – see Mr Godfrey. Third, if one were using a technique for removing the coating (which is a prelude to the actual activity of through-plating) such as Thorn's hot air gun, the waxed product would probably move aside more readily with less heat being applied. This last point was not directly addressed in the evidence, but I consider it to be a sensible inference from it. While comparative tests have not been carried out in relation to these three specific features, I consider that they have been proved in relation to the Thorn product by combining the expert evidence as to the effect of the introduction of wax into a thermoplastic product with the results of Experiments 1, 2, 4 and 5, which compared the flow, viscosity and melting qualities of the Thorn product with a waxless product and which demonstrated that it had the effects in those areas which would give rise to the three areas of facilitation that I have identified.
(iv) I do not consider that it has been established that there is any relevant "healing" characteristic that has been demonstrated in relation to the Thorn product. The evidence on healing was theoretical, and Mr Godfrey did not consider that it had been demonstrated that it occurred in the context of a repair or through-plating exercise. I agree. While it was common ground that the wax would heal itself when something very thin like an electrical probe was pushed through, it was not demonstrated that the more invasive exercises involved in through-plating or soldering would be accompanied by such an exercise. Prof Ehrenstein's evidence was of theory. I do not accept it has been demonstrated in the real world."
"In the light of those factual conclusions it is therefore necessary to consider whether it has been established that the inclusion of wax in Thorn's product "facilitates" through-plating or soldering through the coating in the sense on which those concepts are used in the patent in suit. Siemens' case on this has two limbs – the facilitation of invading the coating, and the healing qualities afterwards. The second of those limbs has not been established. It has not been established that Thorn's coating heals in a material sense. The first, however, has. I consider that the body of evidence as to the general properties of the Thorn product is just sufficient to demonstrate that in use it has the quality of allowing easier access to the board and components through the coating because it can be had at lower temperatures, and with less risk of heat damage to the coating. This is a real practical benefit, and the quality facilitates the two exercises of through-plating and soldering through the coating – it makes it easier to achieve."
First finding: reducing risk of charring
"… the presence of wax means that melting occurs more easily and therefore charring or similar damage to the film is less likely to arise from heating at the high temperature of a "normal" soldering iron…"
i) The presence of wax means that melting occurs more easily; andii) Because melting occurs more easily charring or similar damage to the film is less likely at the high temperature of a normal soldering iron.
"66…It was said that the wax lowers the melting or softening point of the material, reduces its viscosity, increase its wetting capability and lowers its surface tension, and that those qualities would mean that operating at a theoretical level, and without necessarily requiring actual demonstration experimentally, it would facilitate through-plating and soldering by melting more easily and flowing back to preserve its protective qualities as a covering for the board and its components.
67. At the end of the day the evidence of the experts demonstrated that a thermoplastic film with wax would have the inherent qualities that I have referred to when compared with a thermoplastic film without those qualities – it would have a lower softening point, reduced viscosity, increased wetting capability and lower surface tension. Mr Godfrey essentially accepted all those points."
i) That in the absence of wax burning or charring was a real possibility and
ii) That the addition of wax materially reduced that risk.
"The soldering rod locally heats the coating material very rapidly, whereas burning and other degradations of the materials are to be avoided."
Second finding: Lower temperature soldering iron
"…there would be a noticeable difference if one were using a lower temperature soldering iron…"
"Q. If you are reducing its softening temperature or melting temperature, it is always going to be easier, is it not, to push something hot through it?
A. It depends what you call "easier". When you have something that is above 300 degrees Centigrade in normal use going into a film with a softening point around 120 to 170 degrees C, there is no comparison. If you were going to try and push something into it that is around 200 degrees C, then there is a difference. But because the temperature of the soldering rod is so extreme compared to the plastic material, there would be no real comparison."
"Q. So you are reducing the viscosity and improving the wetting by adding the wax you are going to facilitate pushing something through the coating, are you not?
A. Yes. But the way -- if we are using the soldering example, the difference between the temperature of the solder rod and the softening point of the material is far apart. If there was a case where you were already 20 degrees above the softening point of the film you would then be able to gently push the film apart and even possibly use the tip of the soldering rod to actually cut into the film and control what you are doing. But if you are going to talk about typical, standard soldering operations this is going to make no difference because your temperature differences are so extreme."
"Q. If it is closer to its melting point it is going to liquidate more easily, is it not?
A. If the -- if you are looking at controlling the temperature of a soldering iron or using a lower temperature soldering iron to [push] through, which is closer to the temperature of the melting point, then, yes, you would get that, but when you have one soldering iron at a fixed temperature of a particular job soldering and try and do it, the amount of wax that changes because you are down around 120 to 170 degrees C it is going to make no real difference because thermoplastics, it is going to melt and run away.
Q. So it is all a question of degree?
A. It is a question of degree, yes."
Third finding: easier removal of coating
"if one were using a technique for removing the coating (which is a prelude to the actual activity of through-plating) such as Thorn's hot air gun, the waxed product would probably move aside more readily with less heat being applied."
"A. Yes, but you would actually effectively remove the coating. The way I would consider repair is you remove the coating by using heat, a hot air gun or thermostatically-controlled soldering iron, so you can get at the faulty component. You can repair that component. But you will need to put a patch of the thermoplastic film back on over to guarantee you have a full coating there.
Q. That repair would be made easier, would it not, by having added the wax, it is going to be easier to take the coating off?
A. The repair would be made easier by having added the wax because you have softened the film, you have made the film softer, therefore it is more easy to remove."
Fusing onto the board
"is fused onto the printed circuit board by the action of heat".
"i) During the process the pressure pad is maintained at a temperature of between 50° and 80°C "to ensure that the polyolefin sealant patch material is at an optimal condition to achieve good adhesion to the printed circuit board and adopt the contour of the various SM [surface mounted] components.."
k) The silicone moulded pad presses the polyolefin sealant patch into intimate contact with the underside of the PCB so that it adheres to its contour."
"75 Yet again this part of the case is bedevilled by a failure to carry out more direct experiments to prove the point in issue, so that the claimant's case is dependent on evidence of how the experts would expect the product to behave under certain circumstances rather than direct evidence of how it did behave under the conditions in question. It was certainly proved that by the time the Thorn film reached 50ºC it had started to melt in the sense of becoming flexible. The hotter it got, the softer it got. Its flow properties improved. What was not demonstrated was that if placed over a board it would flow unassisted at temperatures within the range so as to adhere to the board and furthermore to achieve a virtually air-tight and moisture proof seal. If it had been proved that the application of the temperature alone would inevitably have had those effects and results then the assistance of pressure and vacuum would not have prevented infringement. However, that was not done. But for one point we are left to ascertain the effect of the heat from inferences from the general properties of the product."
"if placed over a board it would flow unassisted at temperatures within the range so as to adhere to the board and furthermore to achieve a virtually air-tight and moisture proof seal."
"76 That one point is paragraph (i) of Thorn's product and process description, set out above. It seems to me that on the true construction of the patent the application of heat in this integer is to achieve two things. First, it causes a melting (softening) so that the film comes into close conformal contact with the board and its population, and second it gives rise to adhesion so that it stays there. In Claim 1 those two things are produced by the effect of heat alone. In Claim 10 there is a prior step of pressing on to the modules by means of a silicone plug to produce a tight fitting topography and displace residual air, and then as a final process there is fusion under the action of further hearing, but the last step is the same – the final step of producing a conformal coating and adhesion is achieved by heating. This is borne out by one of the preferred embodiments in the specification, which essentially describes the events in Claim 10. If one turns to paragraph (i) of the product and process description one finds both those factors described as part of the Thorn process – the temperature is maintained at 50º - 80º "to achieve good adhesion to the printed circuit board and adopt the contour of the various SM components". That seems to me to be describing this integer. Thorn is there describing the significance of the heat – it is the heat that achieves the final desired result. It is true that the pressure is also described as making the film adhere to the contour of the PCB, but I consider that when the process is put together in the proper sequence it is the heat that does the final job, as described in claim 1 (and, incidentally, in Claim 10)."
Assignment:
"68 Effect of non-registration on infringement proceedings
Where by virtue of a transaction, instrument or event to which section 33 above applies a person becomes the proprietor or one of the proprietors or an exclusive licensee of a patent and the patent is subsequently infringed, the court or the comptroller shall not award him damages or order that he be given an account of the profits in respect of such a subsequent infringement occurring before the transaction, instrument or event is registered unless—
(a) the transaction, instrument or event is registered within the period of six months beginning with its date; or
(b) the court or the comptroller is satisfied that it was not practicable to register the transaction, instrument or event before the end of that period and that it was registered as soon as practicable thereafter."
"33 Effect of registration, etc, on rights in patents
(1) Any person who claims to have acquired the property in a patent or application for a patent by virtue of any transaction, instrument or event to which this section applies shall be entitled as against any other person who claims to have acquired that property by virtue of an earlier transaction, instrument or event to which this section applies if, at the time of the later transaction, instrument or event—
(a) the earlier transaction, instrument or event was not registered, or(b) in the case of any application which has not been published, notice of the earlier transaction, instrument or event had not been given to the comptroller, and(c) in any case, the person claiming under the later transaction, instrument or event, did not know of the earlier transaction, instrument or event.
(2) Subsection (1) above shall apply equally to the case where any person claims to have acquired any right in or under a patent or application for a patent, by virtue of a transaction, instrument or event to which this section applies, and that right is incompatible with any such right acquired by virtue of an earlier transaction, instrument or event to which this section applies.
(3) This section applies to the following transactions, instruments and events:—
(a) the assignment or assignation of a patent or application for a patent, or a right in it;(b) the mortgage of a patent or application or the granting of security over it;(c) the grant, assignment or assignation of a licence or sub-licence, or mortgage of a licence or sub-licence, under a patent or application;(d) the death of the proprietor or one of the proprietors of any such patent or application or any person having a right in or under a patent or application and the vesting by an assent of personal representatives of a patent, application or any such right; and(e) any order or directions of a court or other competent authority—(i) transferring a patent or application or any right in or under it to any person; or(ii) that an application should proceed in the name of any person;and in either case the event by virtue of which the court or authority had power to make any such order or give any such directions.
(4) Where an application for the registration of a transaction, instrument or event has been made, but the transaction, instrument or event has not been registered, then, for the purposes of subsection (1)(a) above, registration of the application shall be treated as registration of the transaction, instrument or event."
"Property in patents and applications, and registration
30 Nature of, and transactions in, patents and applications for patents
(1) Any patent or application for a patent is personal property (without being a thing in action), and any patent or any such application and rights in or under it may be transferred, created or granted in accordance with subsections (2) to (7) below.
(2) Subject to section 36(3) below, any patent or any such application, or any right in it, may be assigned or mortgaged.
(3) Any patent or any such application or right shall vest by operation of law in the same way as any other personal property and may be vested by an assent of personal representatives.
(4) Subject to section 36(3) below, a licence may be granted under any patent or any such application for working the invention which is the subject of the patent or the application; and—
(a) to the extent that the licence so provides, a sub-licence may be granted under any such licence and any such licence or sub-licence may be assigned or mortgaged; and(b) any such licence or sub-licence shall vest by operation of law in the same way as any other personal property and may be vested by an assent of personal representatives.
(5) Subsections (2) to (4) above shall have effect subject to the following provisions of this Act.
(6) Any of the following transactions, that is to say—
(a) any assignment or mortgage of a patent or any such application, or any right in a patent or any such application;(b) any assent relating to any patent or any such application or right;
shall be void unless it is in writing and is signed by or on behalf of the parties to the transaction (or, in the case of an assent or other transaction by or on behalf of a personal representative) or in the case of a body corporate in so signed or is under the seal of that body.
[(6A) If a transaction mentioned in subsection (6) above is by a body corporate, references in that subsection to such a transaction being signed by or on behalf of the assignor or mortgagor shall be taken to include references to its being under the seal of the body corporate.]
(7) An assignment of a patent or any such application or a share in it, and an exclusive licence granted under any patent or any such application, may confer on the assignee or licensee the right of the assignor or licensor to bring proceedings by virtue of section 61 or 69 below for a previous infringement or to bring proceedings under section 58 below for a previous act."
"In the moment that the merger is registered in the commercial register, the whole legal estate of the transferring company is uno actu transferred automatically to the surviving company. All of the rights and liabilities of the transferring company are transferred and two-sided legal relationships are transferred without the other party's consent."
"No authority ordered or directed anything. The evidence is plain. The registering authorities received the information relating to the mergers and entered it on to the register. Their function was administrative, not directive. The authorities did not direct that anything should happen. They merely made an entry which they were obliged to make, and which had certain legal consequences." ([105])
"560. Clearly it is most important for the proper functioning of the patent system that information concerning ownership of, and other interests in, patents should be as readily available as possible. Thus, in principle we are sympathetic to suggestions made to us in evidence that the register should contain more information than it does at present. However, we have also borne in mind that the register should not become overloaded with information of little or no value, and that a requirement that information should be registered is dependent upon an effective sanction in the event of non-compliance with the requirement. This latter point is one of especial importance and difficulty, since it is generally recognised that Section 74(6) provides no incentive for registration unless Court proceedings are imminent, when the interested party can rectify his omission without penalty. Although we would not wish to abolish the provision of Section 74(6) we think that it should be supplemented by more effective encouragement to the registration of changes in the ownership of patents and the grant of exclusive licences in respect thereof. Ownership of a patent or the holding of an exclusive licence confers the most important of all patent rights, that of bringing an action against an infringer, and it follows that in these respects the register should always be complete and up to date. To encourage registration more actively, we therefore propose that the Patents Act should provide, subject to a grace period of six months for registration, that where a change in ownership of a patent has occurred, or an exclusive licence has been granted thereon, no damages for infringement (or an account of profits in lieu of damages) should be recoverable by the new owner or by the exclusive licensee in respect of infringing acts committed prior to the registration of the plaintiff's interest.
561. …
We recommend that:
The Patents Act should provide that where there has been a change of ownership of a patent, or where an exclusive licence has been granted on a patent, no damages for infringement should be recoverable by the new owner or the exclusive licensee in respect of infringing acts committed during the period in which the change of ownership or grant of exclusive licence was not registered, unless registration was effected within six months of the change of ownership or grant of exclusive licence.…"
Result: